Chiranjib Saha

Chiranjib Saha

3GPP Standards Engineer at Qualcomm | PhD in Wireless Communication

About me

I received the B.E. degree (Hons.) in electronics and telecommunication engineering from Jadavpur University, India, in 2015. I completed my M.S and PhD (dual degree) at Virginia Tech, in Bradley Department of Electrical and Computer Engineering. I am presently a Senior Engineer at Qualcomm Technologies, working on standardization activities in 3GPP. I have held summer internship positions at Samsung Reseach America, Plano, TX, USA, Nokia Bell Labs, Naperville, IL, USA, and the National University of Singapore. I was a recipient of the Wireless Fellowship awarded by Wireless@VT, Virginia Tech, in 2015.

Research Interests

  1. Physical (PHY) layer communication.
  2. Stochastic Geometry
  3. Signal Processing
  4. Machine Learning

Photography

I also identify myself as an amateur photographer and camera enthusiast. You can check my small gallery by in instagram and flikr. Please feel free to send a message in any social network platform or email if you are interested to discuss about photography.

News and Updates

2020

  • [Aug 2020] Joining Qualcomm Inc. as senior engineer.
  • [Aug 2020] Successfully defended PhD thesis. Link to dissertation and slide.
  • [Aug 2020] Papers on load analysis and meta distribution of PCP-based general HetNet models appearing in IEEE Wireless Comm. Letters.

2019

2018

  • [Dec 2018] Submitted paper on unified coverage analysis of HetNets.
  • [Dec 2018] Paper on mm-wave IAB accepted in IEEE Transactions on Wireless Communication.
  • [Jun 2018] Joined Nokia Bell labs as summer intern.

2017

  • [Dec 2017] Paper accepted in IEEE Transactions on Communications.
  • [Feb 2017] Submitted invited paper on PCP-based HetNet modeling to ITA, 2017.

2016

  • [Dec 2016] Paper accepted in IEEE Transactions on Wireless Communication.
  • [Dec 2016] Cleared PhD qualifying exam.
  • [Jan 2016] Paper accepted in ICC, 2016.

2015